OUR PRINCIPALS
Concord Technical
Sales (CTS) currently represents the following
leading manufacturers of process equipment.
DYNATEX provides a wafer dicing system that
integrates coolant and lubricant treated water during dicing or wafer
processing. The KerfAidtm Lubricant is a
proven way to deliver top performance as it lowers friction and surface
tension. The Dynatex DXL Injector that inserts the KerfAid
lubricant provides a steady stream using a continuous water supply.
The results are improved die yield and reliability and an
extended blade life. For detailed product specifications, Contact
CTS or
visit Dynatex
International at www.dynatex.com.
ProTemp Products, Inc. is the leading supplier of
high quality elements and furnace retrofit products for decades.
The list of specialty items includes Diffusion Furnaces, Gas
Systems, LPCVD, PECVD, and Solar Reactors. Parts are available for a
variety of configurations. For detailed product information, contact CTS or visit ProTemp
Products, Inc. at
www.protempproducts.com.
HYBOND offers a complete line of Bonders with
specifications that can be configured to the customer's requirements.
The Epoxy/Silver Glass Die Bonder is semi-automatic and provides
for uniform epoxy of silver glass dispensing with consistent material
thickness and precise die placement. HYBOND's
Eutectic/Thermoplastic Die Bonder is used where heat is required at the
die pick up tool and /or the package work stage. The Thermosonic Ball
Bonder features HYBOND's Soft Touch energy system for bonding to
sensitive materials. It is also available as a Deep Access/Long Reach
model. The Thermosonic Wire and Ribbon Wedge Bonder has superior wire
control by utilizing a motorized feed and clamping system with front
panel operator adjustment. Also available in a Deep Access/Long Reach
model. The Programmable Thermosonic Wire & Ribbon Wedge Bonder
features a motorized wire feed system. Incremental automation adds
optimum bonding performance as semi-automatic or automatic bonding
capability is added to the basic unit.
PAC TECH PACKAGING TECHNOLOGIES offers manual and
automatic production equipment for electroless Ni/Au-bumping on the
wafer level. Their product line includes the PacLine 2000 series for
wafers up to 12". The semiautomatic or automatic Solder Ball
Bumper features flexible ball placement and laser reflow of solder
balls for CSP, BGA, Flip Chip, Sensors, 3-D Packages and Wafers. PAC
TECH's High Speed Scan System offers ultrafast wafer optical
inspection. The Automatic LAPLACE Bonder is used for the
attachment of flip chips and flex, polyester, PVC and paper-based
low-cost substrates. For detailed specifications on any of these
products, Contact
CTS or
visit www.pactech.de.
ULTRON SYSTEMS, INC. offers a complete line of
Precision Die Bonders, Die/Wafer Handling films, wafer cleaning
systems, UV curing systems, die matrix expanders, and film
applicators and removers. Bonders include the accurate and
consistent Semiautomatic Eutectic Die Bonder and Epoxy Die Bonder.
Their UV Curing Systems come in three models specifically designed to
meet customer's output needs. Films are anti-static and silicon
free, and available in various widths, thicknesses, adhesive strengths,
and base materials to meet your process requirements. For detailed
specifications on any of these products, Contact
CTS or
visit www.ultronsystems.com.
Concord Technical Sales - Your Link To The Latest
Technology
